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[Pb-free] List of Solder Pastes
SAC305-based
| Alloy Name | Flux Name | Features |
| LFM-48 | PZV | Exhibits excellent wettability at low peak temperature, Low void, Exhibits excellent wettability for the surface of base materials |
| TM-HP | Exhibits excellent preheating at high temperature, Exhibits excellent wettability | |
| GT | Low void, Exhibits excellent wettability for the surface of base materials | |
| SSK-V | For high-speed printing | |
| SUC | Exhibits excellent printability, Exhibits excellent wettability for the surface of base materials | |
| PMK | Prevents flux spattering | |
| DS-RMA | Highly reliable, RMA type | |
| MR-NH | High aspect ratio printing, Halogen free | |
| NH（LVA） | Highly reliable, Low void, Halogen free | |
| NH（IMT） | Exhibits high insulation under high temperature, Halogen free | |
| G-40A | Prevents flux residue cracking and spattering |
Low Melting Point
| Alloy Name | Flux Name | Features |
| LFM-70 | INP | In-based low melting point solder paste |
| LFM-71 |
High Melting Point
| Alloy Name | Flux Name | Features |
| LFM-57 | TM-HP | Sn-Sb-based high melting point solder paste |
| LFM-74 |
High Strength
| Alloy Name | Flux Name | Features |
| SJM-40 | DS-RMA/NH(IMT) | 4 Ag-based high strength solder paste |
| SJM-10 | GT | 1 Ag-based high strength solder paste |
| SJM-03 | GT | 0.3 Ag-based high strength solder paste |
Low Ag
| Alloy Name | Flux Name | Features |
| LFM-86 | TM-HP/GT | Low Ag alloy solder paste |
| LFM-90 |
*SJM-10 and SMJ-03 are patented in Japan (JP PAT No.3966554) and in the United States (US PAT No.7138086B2).
