Solder that Prevents Deterioration of Soldering Iron Tips (Core Solders)

LFM-M/S Series
 
These products prevent deterioration of soldering iron tips, which is a major problem in Pb-free products.
They reduce the frequency of tip replacement while realizing stable soldering and cost reduction.
 
 

 
Alloy Properties

Category		Core Solder that Prevents Deterioration of Iron Tips	JEITA Alloy	Test Method
Alloy Name		LFM-48S/LFM-48M	LFM-48
Alloy Composition		Sn-3.0Ag-0.5Cu-α	Sn-3.0Ag-0.5Cu
Liquidus Temperature (℃)		221	220	DSC Test
Solidus Temperature (℃)		217	217	DSC Test
Tensile Strength (MPa)		46	44	※JIS Tensile Test
Yield Strength (MPa)		39	38	JIS Tensile Test
Elongation (%)		47.5	48.2	JIS Tensile Test
Work Hardening Coefficient		0.032	0.040	JIS Tensile Test
Young’s Modulus (GPa)		52	50	Ultrasonography
Poisson’s Ratio		0.35	0.36	Ultrasonography
Specific Gravity		7.4	7.4	Digital Hydrometer
Specific Heat (J/g K)		0.23	0.23	Laser Flash Method
Thermal Conductivity (%)		65.9	63.2	Laser Flash Method
Thermal Expansion Rate (%) 100℃		0.172	0.173	Vertical Dilatometer
Thermal Expansion Coefficient(10-6/K)	20-100℃	21.6	21.6	Vertical Dilatometer

 
Core Solder that Prevents Deterioration of Iron Tips

Flux	Alloy Name	Alloy Composition	Melting Spot	Alloy Category	Antioxidant Effect for Iron Tips
All types of flux	LFM-48S	Sn-3.0Ag-0.5Cu-α	217-221℃	SAC305	×
	LFM-48M	Sn-3.0Ag-0.5Cu-α	217-221℃	SAC305	○
	LFM-86S	Sn-0.3Ag-0.7Cu-α	217-228℃	Low Ag	○
	SJM-03S	Sn-0.3Ag-0.7Cu-2.0Bi-α	210-226℃	Low Ag + High Strength	○
	LFM-41S	Sn-0.3Ag-2.0Cu-α	217-270℃	Alloys that prevent Cu leaching	○
	LFM-22S	Sn-0.7Cu-α	227-228℃	Sn-Cu	○

*LFM-48M and SJM-03S are patented in Japan (JP PAT No.3966554) and in the United States (US PAT No.7138086B2).